As a system partner, we have been solving a wide variety of customer requirements for 50 years. Our philosophy is, that there is an optimal production and logistics solution for every product which we define as part of the industrialisation process.
from 01005, QFP, QFN, PGA, BFA, LSP, containing or lead free, THT components.
Single/multilayer printed circuit boards of up to 32 layers, copper core, aluminium core, flexible or flex-rigid printed circuit boards.
All current surfaces, printed circuit board thicknesses from 0.2 mm to 8 mm, maximum printed board size 600 x 400 mm in any arbitrary geometry, even round printed circuit boards.
Wave, convection, selective soldering, under optional nitrogen atmosphere, vapour phase soldering. All lead-free (ROHS-compliant) or leaded.
Also manual and mechanical painting of assemblies, casting with single- and two-component casting resin, assembly lines for assemblies and complete devices.