With clear goals into the future
We take it as a given that we continuously optimise and further develop our performance. In terms of technological advances, we define our own new opportunities, making technologies available in collaboration with the semiconductor industry.
We have already introduced and tested processes that will interest you as a customer tomorrow. New housing designs and new processes arising as a result of semiconductor miniaturization are already tested before they are confronted by the changing situation – even before your requirements come into existence.
We offer you stand-alone features using new assembly technologies and the implementation of new housing designs.
Our services include:
Production technologies
- SMT
- THT:
IC assembly
Axial & radial assembly
Manual component placement
Connection technologies
- Lead-free (RoHS-compliant) and lead soldering
- Vapour-phase soldering
- Wave-soldering under a nitrogen shield
- Selective wave-soldering under a nitrogen shield
- Convection reflow soldering under a nitrogen shield
- Manual soldering
- Pressfit technologies
Product processing and mounting
- Casting for one- and two-component casting resins
- Conformal coating
- Robot-controlled painting of assemblies
- Wiring equipment
- Mounting equipment and mechanical systems
